EVA Dow DuPont 560
EVA Dow DuPont 560
Product Introduction EVA Dow DuPont 560 is an ethylene‑vinyl‑acetate copolymer resin. It is widely used in industrial fields due to its balanced overall performance.
Main Applications
Films and Sheets: Used for manufacturing packaging films including food‑packaging films and heat‑shrinkable films, functional agricultural greenhouse films, as well as intermediate layers for polyolefin laminated films.
Adhesives and Sealants: Applied to produce hot‑melt adhesives for book binding, packaging, furniture edge‑banding and other fields. It is also used in sealants and wax blends.
Wire and Cable: Suitable for wire sheaths to provide electrical insulation and mechanical protection.
Industrial Applications & Compounding: Available for molded and composite articles in various industrial sectors.
Injection‑molded and Foamed Products: Used for injection‑molded industrial components and foamed articles.
Performance Parameters
| Performance Category | Test Item | Test Standard | Test Data | Unit |
|---|---|---|---|---|
| Basic Physical Properties | Vinyl Acetate (VA) Content | ‑ | 15 | wt% |
| Melt Flow Rate (MFR) | 190°C/2.16 kg | 2.5 | g/10min | |
| Density | ASTM D792, ISO 1183 | 0.935 | g/cm³ | |
| Thermal Properties | Vicat Softening Temperature | ASTM D1525, ISO 306 | 71 | ℃ |
| Melting Peak Temperature | ASTM D3418, ISO 3146 | 92 | ℃ |
Applicable Processes
‑Extrusion Molding: Commonly used for films, sheets and wire‑cable sheaths. ‑Injection Molding: For industrial component molding. ‑Blow Molding: For hollow‑container products. ‑Foaming Molding: For foamed articles. ‑Compression Molding, Structural Foam Molding and other processes.
Processing Characteristics
Drying: If the material absorbs moisture, drying before processing is recommended to avoid bubbles or silver streaks in finished parts.
Processing Temperature: It is a critical factor for EVA processing. Melt temperature is recommended not to exceed 230°C. EVA resin has relatively low thermal‑decomposition temperature; excessive temperature will easily cause material degradation.
Mold Temperature: Relatively low mold temperature is generally recommended.
Equipment Selection: Conventional thermoplastic‑processing equipment can be adopted.
Cooling: Products normally require rapid cooling for setting.
Note: All data above is for reference only.
